• Nomination of TEQIP official under TEQIP-III (Revised 15th Jan 19)
• Equity Action Plan (New)r
• Environment Management Plan (New)
• Twinning Agreement (2017-2020) Between Natinal Institute of Technology Raipur
     & Vishwavidyalaya Engineering College Lakhanpur

Different Action Plan for Mentee Institute (VEC Lakhanpur)

• Action Plan for Activities under Twinning Agreement with outcomes - Increase in Student Graduate Rates
• Action Plan for Activities under Twinning Agreement with outcomes - Improved Placement Index
• Action Plan for Activities under Twinning Agreement with outcomes - Other Indicator as Deemed Mutually Appreciated
• Action Plan for Activities under Twinning Agreement with outcomes - Improvement in Faculty
  pedagogical practices and Staff working capabilities

Startup Cell Activities

Workshop on “Generating Ideas/ Innovation Design”, in six workshop series submitted to NPIU
   under 6 months action plan, 3-4 Feb 2018

1.3.1.1 - Procurement of Goods

• Invitation letter for Micro Hardness Tester by Mechanical Department , August 2019
• Package Code: TEQIP-III/nitr/34 IoT Kit for Dept of Information Technology Last date of submission -26.7.2019
• Light weight deflectometer with lateral Geophones and equipped with Desktop/Computer loaded with LWDmod Software
   (I License) Last date of submission 17-June-2019 TEQIP-III/nitr/33.
• Corrigendum in the Enquiry letter - Induction Melting system with casting for Department of Metallurgy- TEQIP-III/nitr/35.
• Induction Melting system with casting for Department of Metallurgy
• Total station for Dept of Mining Engg.
• Procurement under National Competitive Bid
  • TEQIP-III/nitr/37;Printed Circuit Board (PCB) Prototyping Machine;Last date of submission 02.7.2019.
  • Gas Chromatography Mass Spectrometry, Package GI-01, for department Chemical (GC)/Biotechnology/Chemistry
  • Advertisement -NCB
  • Corrigendum - 01
  • Corrigendum - 02


• Corrigendum for Deep Learning Machine-Devbox Department of Computer Science & Engineering
• Deep Learning Machine-Devbox Department of Computer Science & Engineering
• Mettalurgical Microscope with cemera attachement Department of Mechanical Engineering Department
• LED TV of any Reputed Make (50”)Department of Humanities
• DSLR CAMERA WITH 18-135mm USM LENS for Department of Humanities
• Lamp free slim Projector (WXGA Real 3000 Lumens) for Department of Humanities
• Corrigendum for Sic Power Module for Department of Electrical Engineering
• Sic Power Module for Department of Electrical Engineering
• Total Station for Mining Engg Department
• Commercial of the shelf Test bed for SDN/IOT/NFV
• Deep Learning Machine- Devbox
• Notice of Tender Cancellation -Metallurgical Microscope with Camera
• Micro Hardness Tester for Department of Mechanical Engineering
• Total Station for Department of Mining Engineering
• Projectors for Department of Information Technology
• Workstation for Department of Information Technology
• Induction Melting system with casting Department of Metallurgical Engineering
• Multi Electrode Resistivity Imaging System Department of Applied Geology
• DSLR Camera with 18-135mm USM Lens Department of Humanities
• LED TV of any Reputed make (50") Department of Humanities
• Sic Power Module for Department of Electrical Engineering
• Power Module for Department of Electrical Engineering
• Current Probes for Department of Electrical Engineering
• Multi Parameter water portable meter for Department of Civil Engineering
• Spin Coating Unit for Department of Physics
• Printed Circuit Board (PCB) Prototyping Machine for E&TC Department
• Variable DC Power Supply for Department of Electrical Engineering
• Isolated DSO for Department of Electrical Engineering
• Multi Electrode Resistivity Imaging System for Department for Applied Geology
• FNIRS Imaging System for Department of Biomedical Engineering

Procurement of Services

Consultancy Services for Placement Training for improvement of campus Placement of weak students.
• Training for Improvement of campus selection for weak students
• Corrigendum

Grievances Related to Procurement

1.3.2.2 - Research Assistantships
1.3.2.4 - Grant provided under FSD to Organise, Present, Participate in Conference, Expert Lecture, STTP, etc
1.3.2.5 - Grant utilized for Students for Purchase and Characterisation of Samples under R & D Assistance
1.3.2.5 - Grant utilized for Students to attend conference, STTP, Tech Fest etc

1.3.2.7 - Mentoring/Twinning system

• First hand hold meeting with VEC Lakhanpur
• TPO Awareness prgramme with VEC Lakhanpur

Different formats for applying and conducting programs (For faculty and Students)

• Format for Conduction of STTP for Faculties under TEQIP - III
• Format and Guidelines for International Travel
• Policy and Format for Tech Fest and Similar events
• Format for faculty attending Program under TEQIP - III
• Format for Project Support to Student (Consumable/Minor items and attending Conf./Presenting paper)
• Claim For Reimbursement Under Teqip- III

TEQIP - III Manuals

• FM Manual TEQIP-III
• Procurement Manual TEQIP-III
• PIP Mannual TEQIP-III
• Permissible and non permissible guidlines for TEQIP-III

Other Link

• Action plan for sub component 1.3 under TEQIP - III (Jul - Sep 2019)
• Action plan for sub component 1.3 under TEQIP - III (Apr - June 2019)
• Action plan for sub component 1.3 under TEQIP - III (Jan - Mar 2019)
• Action plan for sub component 1.3 under TEQIP - III (Oct - Dec 2018)
• Action plan for sub component 1.3 under TEQIP - III (Jul - Sep 2018)
• Action plan for sub component 1.3 under TEQIP - III (Apr - Jun 2018)
• Action plan for sub component 1.3 under TEQIP - III (Jan - Mar 2018)
• Action plan for sub component 1.3 under TEQIP - III (Oct - Dec 2017)
• Purchase committee for TEQIP - III
• Nomination of TEQIP official under TEQIP-III
• Institute Development Plan for TEQIP-III
• "Guidelines on TA/DA norms for all types of TEQIP - III activities"
• "Good Governance Guidelines "
• Undertaking and PPT to be attached during approval for
  conference, also PPT to be presented during paper presentation in conference

Archive (TEQIP-II/III)